Технічний опис ESQT-140-02-F-D-324-020 Samtec
Description: CONN SOCKET 80POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 80, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: 79, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Length - Post: 0.526" (13.36mm), Insulation Height: 0.324" (8.23mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Інші пропозиції ESQT-140-02-F-D-324-020
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| ESQT-140-02-F-D-324-020 | Виробник : Samtec Inc. |
Description: CONN SOCKET 80POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 80 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: 79 Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Length - Post: 0.526" (13.36mm) Insulation Height: 0.324" (8.23mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
товару немає в наявності |