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FPC050P030-S

FPC050P030-S Chip Quik Inc.

FPC050P030-S.pdf Виробник: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.898" L x 0.157" W (22.80mm x 4.00mm)
Number of Positions: 30
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Технічний опис FPC050P030-S Chip Quik Inc.

Description: FPC/FFC SMT CONN STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: FPC/FFC, Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.898" L x 0.157" W (22.80mm x 4.00mm), Number of Positions: 30.