FPC080P030-S Chip Quik Inc.
Виробник: Chip Quik Inc.Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm)
Number of Positions: 30
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Технічний опис FPC080P030-S Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.031" (0.80mm), Type: FPC/FFC, Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm), Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm), Number of Positions: 30.