FSA2567UMX_F113 onsemi
Виробник: onsemi
Description: INTEGRATED CIRCUIT
Features: Break-Before-Make
Packaging: Bulk
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Telecommunications
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 475MHz
Supplier Device Package: 16-UMLP (1.8x2.6)
Voltage - Supply, Single (V+): 1.65V ~ 4.3V
Switch Circuit: 4PDT
Part Status: Obsolete
Number of Channels: 1
Description: INTEGRATED CIRCUIT
Features: Break-Before-Make
Packaging: Bulk
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Telecommunications
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 475MHz
Supplier Device Package: 16-UMLP (1.8x2.6)
Voltage - Supply, Single (V+): 1.65V ~ 4.3V
Switch Circuit: 4PDT
Part Status: Obsolete
Number of Channels: 1
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Технічний опис FSA2567UMX_F113 onsemi
Description: INTEGRATED CIRCUIT, Features: Break-Before-Make, Packaging: Bulk, Package / Case: 16-UFQFN, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Applications: Telecommunications, On-State Resistance (Max): 10Ohm, -3db Bandwidth: 475MHz, Supplier Device Package: 16-UMLP (1.8x2.6), Voltage - Supply, Single (V+): 1.65V ~ 4.3V, Switch Circuit: 4PDT, Part Status: Obsolete, Number of Channels: 1.