FTM-114-03-F-DV-S-P Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 28POS 1MM
Packaging: Tube
Features: End Shrouds, Pick and Place
Connector Type: Header, Cuttable
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 28
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.038" (0.97mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.039" (1.00mm)
Contact Length - Mating: 0.065" (1.65mm)
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Технічний опис FTM-114-03-F-DV-S-P Samtec Inc.
Description: CONN HEADER SMD 28POS 1MM, Packaging: Tube, Features: End Shrouds, Pick and Place, Connector Type: Header, Cuttable, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 28, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.038" (0.97mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.039" (1.00mm), Contact Length - Mating: 0.065" (1.65mm).