FVP12030IM3LEG1 onsemi
Виробник: onsemiDescription: MODULE SPM 300V VPM19-BA
Packaging: Tray
Package / Case: 19-PowerDIP Module (1.205", 30.60mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: Half Bridge
Voltage - Isolation: 1500Vrms
Part Status: Obsolete
Current: 120 A
Voltage: 300 V
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Технічний опис FVP12030IM3LEG1 onsemi
Description: MODULE SPM 300V VPM19-BA, Packaging: Tray, Package / Case: 19-PowerDIP Module (1.205", 30.60mm), Mounting Type: Through Hole, Type: IGBT, Configuration: Half Bridge, Voltage - Isolation: 1500Vrms, Part Status: Obsolete, Current: 120 A, Voltage: 300 V.