GC1311-154-4 Microchip Technology
Виробник: Microchip Technology
Description: SI TVAR NON HERMETIC EPSM SMT
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Supplier Device Package: Chip
Part Status: Active
Description: SI TVAR NON HERMETIC EPSM SMT
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Supplier Device Package: Chip
Part Status: Active
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Технічний опис GC1311-154-4 Microchip Technology
Description: SI TVAR NON HERMETIC EPSM SMT, Packaging: Tape & Reel (TR), Package / Case: Die, Mounting Type: Surface Mount, Supplier Device Package: Chip, Part Status: Active.