GL535/N ALUTRONIC
Виробник: ALUTRONIC
Category: Heatsinks - equipment
Description: Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV
Application: TO218; TOP3
Thickness: 50µm
Dimensions: 22x18mm
Thermal conductivity: 0.8W/mK
Dielectric strength: 2.5kV
Type of heat transfer pad: mica
Mounting: screw
Category: Heatsinks - equipment
Description: Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV
Application: TO218; TOP3
Thickness: 50µm
Dimensions: 22x18mm
Thermal conductivity: 0.8W/mK
Dielectric strength: 2.5kV
Type of heat transfer pad: mica
Mounting: screw
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Технічний опис GL535/N ALUTRONIC
Category: Heatsinks - equipment, Description: Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV, Application: TO218; TOP3, Thickness: 50µm, Dimensions: 22x18mm, Thermal conductivity: 0.8W/mK, Dielectric strength: 2.5kV, Type of heat transfer pad: mica, Mounting: screw.