HDG200-DN-3 H&D Wireless AB


Wireless_Wi-Fi_Guide_2015.pdf
Виробник: H&D Wireless AB
Description: IC RF TXRX+MCU WIFI 44TQFN
Part Status: Active
Serial Interfaces: SDIO, SPI
RF Family/Standard: WiFi
Supplier Device Package: 44-QFN SIP (8x8)
Current - Transmitting: 197mA
Data Rate (Max): 72.2Mbps
Current - Receiving: 49mA
Protocol: 802.11b/g/n
Power - Output: 17dBm
Voltage - Supply: 2.75V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 1kB EEPROM, 160kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Package / Case: 44-TQFN Exposed Pad Module
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+2769.22 грн
10+2461.81 грн
25+2256.65 грн
80+1957.35 грн
В кошику  од. на суму  грн.
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Технічний опис HDG200-DN-3 H&D Wireless AB

Description: IC RF TXRX+MCU WIFI 44TQFN, Part Status: Active, Serial Interfaces: SDIO, SPI, RF Family/Standard: WiFi, Supplier Device Package: 44-QFN SIP (8x8), Current - Transmitting: 197mA, Data Rate (Max): 72.2Mbps, Current - Receiving: 49mA, Protocol: 802.11b/g/n, Power - Output: 17dBm, Voltage - Supply: 2.75V ~ 3.6V, Operating Temperature: -40°C ~ 85°C, Type: TxRx + MCU, Memory Size: 1kB EEPROM, 160kB SRAM, Frequency: 2.4GHz, Mounting Type: Surface Mount, Package / Case: 44-TQFN Exposed Pad Module, Packaging: Tray, DigiKey Programmable: Not Verified.