HDR-SOICN-80 Chip Quik
Виробник: Chip Quik
Headers & Wire Housings SMT to SOIC-Narrow Header (1.27mm Pitch, 80 Pin, for 150/200 mil IC body) (SOIC80N/SOIC-80N)
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Технічний опис HDR-SOICN-80 Chip Quik
Description: SMT TO SOIC-NARROW HEADER (1.27M, Contact Finish Thickness - Post: 39.4µin (1.00µm), Contact Finish - Post: Gold, Pitch - Post: 0.050" (1.27mm), Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 80 (2 x 40), Operating Temperature: -40°C ~ 130°C, Type: SOIC, Mounting Type: Surface Mount, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції HDR-SOICN-80 за ціною від 321.15 грн до 529.47 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HDR-SOICN-80 | Chip Quik Inc. |
Description: SMT TO SOIC-NARROW HEADER (1.27M Contact Finish Thickness - Post: 39.4µin (1.00µm) Contact Finish - Post: Gold Pitch - Post: 0.050" (1.27mm) Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 80 (2 x 40) Operating Temperature: -40°C ~ 130°C Type: SOIC Mounting Type: Surface Mount Features: Closed Frame Packaging: Bulk |
на замовлення 175 шт: термін постачання 21-31 дні (днів) |
|
| HDR-SOICN-80 |
|
Виробник: Chip Quik Inc.
Description: SMT TO SOIC-NARROW HEADER (1.27M
Contact Finish Thickness - Post: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 80 (2 x 40)
Operating Temperature: -40°C ~ 130°C
Type: SOIC
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Bulk
Description: SMT TO SOIC-NARROW HEADER (1.27M
Contact Finish Thickness - Post: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 80 (2 x 40)
Operating Temperature: -40°C ~ 130°C
Type: SOIC
Mounting Type: Surface Mount
Features: Closed Frame
Packaging: Bulk
на замовлення 175 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 529.47 грн |
| 5+ | 435.88 грн |
| 10+ | 409.93 грн |
| 25+ | 356.52 грн |
| 50+ | 337.83 грн |
| 100+ | 321.15 грн |