HFC02-R10J-RC Allied Components International
Виробник: Allied Components International
Description: 100nH +/-5% Hi-Freq Ceramic Chip
Packaging: Tape & Reel (TR)
Current Rating (Amps): 60 mA
Inductance: 100 nH
Part Status: Active
Height - Seated (Max): 0.013" (0.33mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 100 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 1.05GHz
Q @ Freq: 4 @ 100MHz
DC Resistance (DCR): 3.74Ohm Max
Operating Temperature: -55°C ~ 125°C
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±5%
| Кількість | Ціна |
|---|---|
| 5+ | 67.65 грн |
| 10+ | 64.15 грн |
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Технічний опис HFC02-R10J-RC Allied Components International
Description: 100nH +/-5% Hi-Freq Ceramic Chip, Packaging: Tape & Reel (TR), Current Rating (Amps): 60 mA, Inductance: 100 nH, Part Status: Active, Height - Seated (Max): 0.013" (0.33mm), Supplier Device Package: 0201, Inductance Frequency - Test: 100 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 1.05GHz, Q @ Freq: 4 @ 100MHz, DC Resistance (DCR): 3.74Ohm Max, Operating Temperature: -55°C ~ 125°C, Shielding: Unshielded, Mounting Type: Surface Mount, Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Package / Case: 0201 (0603 Metric), Tolerance: ±5%.