HFC05-8N2J-RC Allied Components International
Виробник: Allied Components International
Description: 8.2nH +/-5% 0603 High Freq Chip
Operating Temperature: -55°C ~ 125°C
Type: Multilayer
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Package / Case: 0603 (1608 Metric)
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current Rating (Amps): 600 mA
Inductance: 8.2 nH
Part Status: Active
Height - Seated (Max): 0.037" (0.95mm)
Supplier Device Package: 0603
Inductance Frequency - Test: 100 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 3.3GHz
Q @ Freq: 10 @ 100MHz
DC Resistance (DCR): 240mOhm Max
| Кількість | Ціна |
|---|---|
| 5+ | 72.38 грн |
| 10+ | 68.57 грн |
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Технічний опис HFC05-8N2J-RC Allied Components International
Description: 8.2nH +/-5% 0603 High Freq Chip, Operating Temperature: -55°C ~ 125°C, Type: Multilayer, Shielding: Unshielded, Mounting Type: Surface Mount, Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm), Package / Case: 0603 (1608 Metric), Tolerance: ±5%, Packaging: Tape & Reel (TR), Current Rating (Amps): 600 mA, Inductance: 8.2 nH, Part Status: Active, Height - Seated (Max): 0.037" (0.95mm), Supplier Device Package: 0603, Inductance Frequency - Test: 100 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 3.3GHz, Q @ Freq: 10 @ 100MHz, DC Resistance (DCR): 240mOhm Max.

