HSEC8-109-01-S-RA-BL-TR Samtec Inc.
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Number of Rows: 2
Number of Positions/Bay/Row: 4; 5
Contact Material: Beryllium Copper
Contact Finish Thickness: 30.0µin (0.76µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 18
Mounting Type: Surface Mount, Right Angle
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Lock
Packaging: Tape & Reel (TR)
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Технічний опис HSEC8-109-01-S-RA-BL-TR Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL, Number of Rows: 2, Number of Positions/Bay/Row: 4; 5, Contact Material: Beryllium Copper, Contact Finish Thickness: 30.0µin (0.76µm), Termination: Solder, Card Thickness: 0.062" (1.57mm), Card Type: PCI Express™, Contact Type: Cantilever, Read Out: Dual, Operating Temperature: -55°C ~ 125°C, Pitch: 0.031" (0.80mm), Number of Positions: 18, Mounting Type: Surface Mount, Right Angle, Color: Black, Contact Finish: Gold, Gender: Female, Features: Board Lock, Packaging: Tape & Reel (TR).