на замовлення 475 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 437.30 грн |
| 25+ | 367.09 грн |
| 50+ | 340.87 грн |
| 100+ | 325.17 грн |
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Технічний опис HSEC8-130-03-L-DV-A-WT-K-TR Samtec
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.093" (2.36mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Beryllium Copper, Number of Positions/Bay/Row: 30, Number of Rows: 2.
Інші пропозиції HSEC8-130-03-L-DV-A-WT-K-TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| HSEC8-130-03-L-DV-A-WT-K-TR | Виробник : Samtec Inc. |
 Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товару немає в наявності |