HTEC8-130-01-S-DV-A-WT-K-TR Samtec Inc.
Виробник: Samtec Inc.Description: 0.80 MM RUGGED HIGH-SPEED EDGE C
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Copper Alloy
Number of Positions/Bay/Row: 30
Number of Rows: 2
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Технічний опис HTEC8-130-01-S-DV-A-WT-K-TR Samtec Inc.
Description: 0.80 MM RUGGED HIGH-SPEED EDGE C, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 30.0µin (0.76µm), Contact Material: Copper Alloy, Number of Positions/Bay/Row: 30, Number of Rows: 2.