IPC0041-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.144" L x 0.104" W (3.65mm x 2.65mm)
Number of Positions: 24
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Технічний опис IPC0041-S Chip Quik Inc.
Description: QFN-24 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: QFN/LFCSP, Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.144" L x 0.104" W (3.65mm x 2.65mm), Number of Positions: 24.
