IPC0116-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: HSOP-30 STENCIL
Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm)
Type: HSOP
Pitch: 0.031" (0.80mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 30
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Технічний опис IPC0116-S Chip Quik Inc.
Description: HSOP-30 STENCIL, Thermal Center Pad: 0.630" L x 0.270" W (16.00mm x 6.85mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm), Type: HSOP, Pitch: 0.031" (0.80mm), Material: Stainless Steel, Packaging: Bulk, Number of Positions: 30.
