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Технічний опис IPC0163 Chip Quik
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1, Packaging: Bulk, Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm), Material: FR4 Epoxy Glass, Number of Positions: 32, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, Part Status: Active.
Інші пропозиції IPC0163
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
IPC0163 | Chip Quik Inc. |
 Description: SOIC-32 TO DIP-32 SMT ADAPTER (1Packaging: Bulk Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| IPC0163 |
|
Виробник: Chip Quik Inc.
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.