IPC0192-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.035" (0.90mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm)
Number of Positions: 36
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.035" (0.90mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm)
Number of Positions: 36
товару немає в наявності
Відгуки про товар
Написати відгук
Технічний опис IPC0192-S Chip Quik Inc.
Description: QFN-36/LFCSP-36 (5 CENTER PADS), Packaging: Bulk, Material: Stainless Steel, Pitch: 0.035" (0.90mm), Type: QFN/LFCSP, Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm), Number of Positions: 36.