Продукція > CHIP QUIK INC. > IPC0209-S

IPC0209-S Chip Quik Inc.

Виробник: Chip Quik Inc.
Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Number of Positions: 28
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Type: PowerQSOP
Pitch: 0.025" (0.64mm)
Material: Stainless Steel
Packaging: Bulk

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Технічний опис IPC0209-S Chip Quik Inc.

Description: POWERQSOP-28 (0.635 MM PITCH 9.9, Number of Positions: 28, Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm), Type: PowerQSOP, Pitch: 0.025" (0.64mm), Material: Stainless Steel, Packaging: Bulk.