IPC0220 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
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Технічний опис IPC0220 Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4, Packaging: Bulk, Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm), Material: FR4 Epoxy Glass, Number of Positions: 6, Pitch: 0.016" (0.40mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: BGA.