IPC0233-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
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Технічний опис IPC0233-S Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: HTQFP, Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm), Number of Positions: 100.