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IS21EF04GP-BCLI-TR ISSI, Integrated Silicon Solution Inc

21-22EF04GP-08GP.pdf Виробник: ISSI, Integrated Silicon Solution Inc
Description: 4GB, 153 BALL FBGA, 3.3V, BOOT P
Packaging: Tape & Reel (TR)
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (MLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-VFBGA (11.5x13)
Memory Interface: eMMC_5.1
Memory Organization: 4G x 8
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Технічний опис IS21EF04GP-BCLI-TR ISSI, Integrated Silicon Solution Inc

Description: 4GB, 153 BALL FBGA, 3.3V, BOOT P, Packaging: Tape & Reel (TR), Package / Case: 153-VFBGA, Mounting Type: Surface Mount, Memory Size: 32Gbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND (MLC), Clock Frequency: 200 MHz, Memory Format: FLASH, Supplier Device Package: 153-VFBGA (11.5x13), Memory Interface: eMMC_5.1, Memory Organization: 4G x 8.