JET551AX30T5 Chip Quik Inc.
Виробник: Chip Quik Inc.Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
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Технічний опис JET551AX30T5 Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN63/P, Packaging: Bulk, Composition: Sn63Pb37 (63/37), Type: Solder Paste, Melting Point: 361°F (183°C), Form: Syringe, 3.53 oz (100g), Process: Leaded, Flux Type: No-Clean, Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.