LH7A400N0G000B5,55 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
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Технічний опис LH7A400N0G000B5,55 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256BGA, Packaging: Tray, Package / Case: 256-BGA, Mounting Type: Surface Mount, Speed: 200MHz, RAM Size: 80K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Program Memory Type: ROMless, Core Processor: ARM9®, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V, Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB, Peripherals: AC'97, DMA, LCD, POR, PWM, WDT, Supplier Device Package: 256-BGA (17x17), Number of I/O: 60, DigiKey Programmable: Not Verified.