LH7A404N0F000B3;55 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Core Size: 32-Bit Single-Core
Data Converters: A/D 9x10b
Core Processor: ARM9®
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 324-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 324-LFBGA (17x17)
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
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Технічний опис LH7A404N0F000B3;55 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA, Core Size: 32-Bit Single-Core, Data Converters: A/D 9x10b, Core Processor: ARM9®, Program Memory Type: ROMless, Oscillator Type: External, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 80K x 8, Speed: 200MHz, Mounting Type: Surface Mount, Package / Case: 324-LFBGA, Packaging: Tray, DigiKey Programmable: Not Verified, Number of I/O: 64, Supplier Device Package: 324-LFBGA (17x17), Peripherals: AC'97, DMA, LCD, POR, PWM, WDT, Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V.