LPC1112LVFHI33/103551 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Number of I/O: 27
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x8b
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Core Processor: ARM® Cortex®-M0
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Технічний опис LPC1112LVFHI33/103551 NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN, Number of I/O: 27, Part Status: Active, Supplier Device Package: 32-HVQFN (5x5), Peripherals: Brown-out Detect/Reset, POR, WDT, Connectivity: I²C, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, Core Size: 32-Bit Single-Core, Data Converters: A/D 6x8b, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 4K x 8, Program Memory Size: 16KB (16K x 8), Speed: 50MHz, Mounting Type: Surface Mount, Package / Case: 32-VFQFN Exposed Pad, Packaging: Bulk, Core Processor: ARM® Cortex®-M0.