LPC1114FHN33/203551 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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Технічний опис LPC1114FHN33/203551 NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN, Packaging: Bulk, Package / Case: 32-VQFN Exposed Pad, Mounting Type: Surface Mount, Speed: 50MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M0, Data Converters: A/D 8x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I²C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, WDT, Supplier Device Package: 32-HVQFN (7x7), Part Status: Active, Number of I/O: 28, DigiKey Programmable: Not Verified.