LPC18S37JBD144551 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
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Технічний опис LPC18S37JBD144551 NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP, Number of I/O: 83, Part Status: Active, Supplier Device Package: 144-LQFP (20x20), Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit Single-Core, Data Converters: A/D 8x10b; D/A 1x10b, Core Processor: ARM® Cortex®-M3, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 136K x 8, Program Memory Size: 1MB (1M x 8), Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 144-LQFP, Packaging: Bulk.