LPC2131FBD64/01118 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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Технічний опис LPC2131FBD64/01118 NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP, Packaging: Bulk, Package / Case: 64-LQFP, Mounting Type: Surface Mount, Speed: 60MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 8K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM7®, Data Converters: A/D 8x10b; D/A 1x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, Supplier Device Package: 64-LQFP (10x10), Part Status: Active, Number of I/O: 47, DigiKey Programmable: Not Verified.