LPC2138FHN64,557 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 64HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Obsolete
Supplier Device Package: 64-HVQFN (9x9)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Bag
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Технічний опис LPC2138FHN64,557 NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 64HVQFN, DigiKey Programmable: Not Verified, Number of I/O: 47, Part Status: Obsolete, Supplier Device Package: 64-HVQFN (9x9), Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Core Size: 16/32-Bit, Data Converters: A/D 16x10b SAR; D/A 1x10b, Core Processor: ARM7®, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 32K x 8, Program Memory Size: 512KB (512K x 8), Speed: 60MHz, Mounting Type: Surface Mount, Package / Case: 64-VFQFN Exposed Pad, Packaging: Bag.