LPC2212FBD144,551 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Bag
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
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Технічний опис LPC2212FBD144,551 NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 144LQFP, Packaging: Bag, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 60MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Number of I/O: 112, DigiKey Programmable: Not Verified.