LPC2292FET144,551 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 16/32BIT 256KB 144TFBGA
Packaging: Bag
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
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Технічний опис LPC2292FET144,551 NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA, Packaging: Bag, Package / Case: 144-TFBGA, Mounting Type: Surface Mount, Speed: 60MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 144-TFBGA (12x12), Part Status: Obsolete, Number of I/O: 112, DigiKey Programmable: Not Verified.