LPC43S70FET100551 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 282K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Bulk
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Технічний опис LPC43S70FET100551 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA, Number of I/O: 49, Part Status: Active, Supplier Device Package: 100-TFBGA (9x9), Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 16x10b, 6x12b; D/A 1x10b, Core Processor: ARM® Cortex®-M4/M0, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 282K x 8, Speed: 204MHz, Mounting Type: Surface Mount, Package / Case: 100-TFBGA, Packaging: Bulk.