LPC54S016JET180 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Number of I/O: 145
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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Технічний опис LPC54S016JET180 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA, Number of I/O: 145, Part Status: Active, Supplier Device Package: 180-TFBGA (12x12), Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 12x12b SAR, Core Processor: ARM® Cortex®-M4, Program Memory Type: ROMless, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 360K x 8, Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 180-TFBGA, Packaging: Tray, DigiKey Programmable: Not Verified.