MBG0002G24 MOREK
Виробник: MOREK
Category: Encapsulating materials
Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 300g
Type of chemical agent: silicone encapsulating compound
Application: filling; isolation
Operating temperature: -60...200°C
Dielectric strength: 23kV/mm
Agent features: high dielectric strength
Net weight: 300g
Kind of package: tube
| Кількість | Ціна |
|---|---|
| 1+ | 2212.74 грн |
| 3+ | 1871.03 грн |
| 5+ | 1591.76 грн |
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Технічний опис MBG0002G24 MOREK
Category: Encapsulating materials, Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 300g, Type of chemical agent: silicone encapsulating compound, Application: filling; isolation, Operating temperature: -60...200°C, Dielectric strength: 23kV/mm, Agent features: high dielectric strength, Net weight: 300g, Kind of package: tube.