MBG0002G24 MOREK
Виробник: MOREK
Category: Encapsulating materials
Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 300g
Application: filling; isolation
Agent features: high dielectric strength
Type of chemical agent: silicone encapsulating compound
Kind of package: tube
Operating temperature: -60...200°C
Net weight: 300g
Dielectric strength: 23kV/mm
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2215.45 грн |
| 3+ | 1873.54 грн |
| 5+ | 1594.27 грн |
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Технічний опис MBG0002G24 MOREK
Category: Encapsulating materials, Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 300g, Application: filling; isolation, Agent features: high dielectric strength, Type of chemical agent: silicone encapsulating compound, Kind of package: tube, Operating temperature: -60...200°C, Net weight: 300g, Dielectric strength: 23kV/mm.