MBG0002G24 MOREK
Виробник: MOREK
Category: Encapsulating materials
Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 300g
Application: filling; isolation
Type of chemical agent: silicone encapsulating compound
Operating temperature: -60...200°C
Net weight: 300g
Dielectric strength: 23kV/mm
Agent features: high dielectric strength
Kind of package: tube
| Кількість | Ціна |
|---|---|
| 1+ | 2218.89 грн |
| 3+ | 1876.60 грн |
| 5+ | 1597.12 грн |
Відгуки про товар
Написати відгук
Технічний опис MBG0002G24 MOREK
Category: Encapsulating materials, Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 300g, Application: filling; isolation, Type of chemical agent: silicone encapsulating compound, Operating temperature: -60...200°C, Net weight: 300g, Dielectric strength: 23kV/mm, Agent features: high dielectric strength, Kind of package: tube.