MC32PF3001A5EP NXP USA Inc.
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
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Технічний опис MC32PF3001A5EP NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-, Packaging: Tray, Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 2.8V ~ 5.5V, Applications: Processor, Supplier Device Package: 48-HVQFN (7x7).