Технічний опис MC33FS5502Y3KSR2 NXP Semiconductors
Description: HIGH VOLTAGE POWER MANAGEMENT IC, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 60V, Applications: SMPS Start-Up, Supplier Device Package: 56-HVQFN (8x8), Grade: Automotive, Qualification: AEC-Q100.
Інші пропозиції MC33FS5502Y3KSR2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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MC33FS5502Y3KSR2 | Виробник : NXP USA Inc. |
 Description: HIGH VOLTAGE POWER MANAGEMENT ICPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: SMPS Start-Up Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |