Продукція > NXP USA INC. > MC68376BGCAB25
MC68376BGCAB25

MC68376BGCAB25 NXP USA Inc.


MC68376_336.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 160-QFP (28x28)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 16x10b
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 7.5K x 8
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Технічний опис MC68376BGCAB25 NXP USA Inc.

Description: IC MCU 32BIT ROMLESS 160QFP, DigiKey Programmable: Not Verified, Number of I/O: 18, Supplier Device Package: 160-QFP (28x28), Speed: 25MHz, Mounting Type: Surface Mount, Package / Case: 160-BQFP, Packaging: Tray, Peripherals: POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, SCI, SPI, Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V, Core Size: 32-Bit, Data Converters: A/D 16x10b, Core Processor: CPU32, Program Memory Type: ROMless, Oscillator Type: External, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 7.5K x 8.