MC9S12UF32PUE NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 3.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Peripherals: POR, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 3.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Peripherals: POR, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
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Технічний опис MC9S12UF32PUE NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP, Packaging: Tray, Package / Case: 100-LQFP, Mounting Type: Surface Mount, Speed: 30MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 3.5K x 8, Operating Temperature: 0°C ~ 70°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: HCS12, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V, Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB, Peripherals: POR, WDT, Supplier Device Package: 100-LQFP (14x14), Number of I/O: 73, DigiKey Programmable: Not Verified.