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MFS2303BMBA3EPR2

MFS2303BMBA3EPR2 NXP USA Inc.

FS23DS.pdf
Виробник: NXP USA Inc.
Description: MFS2303BMBA3EPR2
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 40µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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Технічний опис MFS2303BMBA3EPR2 NXP USA Inc.

Description: MFS2303BMBA3EPR2, Supplier Device Package: 48-HVQFN (7x7), Current - Supply: 40µA, Applications: System Basis Chip, Voltage - Supply: 5.5V ~ 40V, Operating Temperature: -40°C ~ 125°C (TA), Mounting Type: Surface Mount, Wettable Flank, Package / Case: 48-VFQFN Exposed Pad, Packaging: Tape & Reel (TR).