MIMX9331XVTXMAB NXP USA Inc.
Виробник: NXP USA Inc.Description: IC
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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Технічний опис MIMX9331XVTXMAB NXP USA Inc.
Description: IC, Packaging: Bulk, Package / Case: 306-LFBGA, FCBGA, Mounting Type: Surface Mount, Speed: 250MHz, 1.7GHz, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33, Voltage - I/O: 1.8V, Supplier Device Package: 306-FCBGA (14x14), Ethernet: GbE (2), USB: USB 2.0 (2), Number of Cores/Bus Width: 2 Core, 64-Bit, Co-Processors/DSP: Multimedia; NEON™ MPE, RAM Controllers: LPDDR4, Graphics Acceleration: No, Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI, Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection, Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART.