MPC555LFMZP40R2 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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Технічний опис MPC555LFMZP40R2 NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA, Packaging: Tape & Reel (TR), Package / Case: 272-BBGA, Mounting Type: Surface Mount, Speed: 40MHz, Program Memory Size: 448KB (448K x 8), RAM Size: 26K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Program Memory Type: FLASH, Core Processor: PowerPC, Data Converters: A/D 32x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 272-PBGA (27x27), Number of I/O: 101, DigiKey Programmable: Not Verified.