MPF5300BMMALES NXP Semiconductors
Виробник: NXP Semiconductors
Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch
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Технічний опис MPF5300BMMALES NXP Semiconductors
Thermal enhanced, very-very thin quad flat package, no leads, 24 terminals, step-cut wettable flank, 0.5 mm pitch.

