MS06 Apex Microtechnology
Виробник: Apex MicrotechnologyDescription: CONN SOCKET SIP 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 816.27 грн |
| 10+ | 742.52 грн |
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Технічний опис MS06 Apex Microtechnology
Description: CONN SOCKET SIP 20POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.