Технічний опис MSC8103VT1100F NXP Semiconductors
Description: IC DSP 16BIT 275MHZ 332FCBGA, Packaging: Tray, Package / Case: 332-BFBGA, FCBGA, Mounting Type: Surface Mount, Interface: Communications Processor Module (CPM), Type: SC140 Core, Operating Temperature: -40°C ~ 105°C (TJ), Non-Volatile Memory: External, On-Chip RAM: 512KB, Voltage - I/O: 3.30V, Voltage - Core: 1.60V, Clock Rate: 275MHz, Supplier Device Package: 332-FCBGA (17x17), Part Status: Obsolete.
Інші пропозиції MSC8103VT1100F
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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MSC8103VT1100F | Виробник : NXP USA Inc. |
 Description: IC DSP 16BIT 275MHZ 332FCBGAPackaging: Tray Package / Case: 332-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Communications Processor Module (CPM) Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 512KB Voltage - I/O: 3.30V Voltage - Core: 1.60V Clock Rate: 275MHz Supplier Device Package: 332-FCBGA (17x17) Part Status: Obsolete |
товар відсутній |