MT29F32G08CBACAL73A3WC1L Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: IC FLASH 32GBIT PARALLEL DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (MLC)
Memory Format: FLASH
Supplier Device Package: Die
Write Cycle Time - Word, Page: 20ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 4G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 32GBIT PARALLEL DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (MLC)
Memory Format: FLASH
Supplier Device Package: Die
Write Cycle Time - Word, Page: 20ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 4G x 8
DigiKey Programmable: Not Verified
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Технічний опис MT29F32G08CBACAL73A3WC1L Micron Technology Inc.
Description: IC FLASH 32GBIT PARALLEL DIE, Packaging: Tray, Package / Case: Die, Mounting Type: Surface Mount, Memory Size: 32Gbit, Memory Type: Non-Volatile, Operating Temperature: 0°C ~ 70°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND (MLC), Memory Format: FLASH, Supplier Device Package: Die, Write Cycle Time - Word, Page: 20ns, Memory Interface: Parallel, Access Time: 20 ns, Memory Organization: 4G x 8, DigiKey Programmable: Not Verified.