MT53B256M32D1DS-062 XT:C Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: IC DRAM 8GBIT 1.6GHZ 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 105°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 8GBIT 1.6GHZ 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 105°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
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Технічний опис MT53B256M32D1DS-062 XT:C Micron Technology Inc.
Description: IC DRAM 8GBIT 1.6GHZ 200WFBGA, Packaging: Tray, Package / Case: 200-WFBGA, Mounting Type: Surface Mount, Memory Size: 8Gbit, Memory Type: Volatile, Operating Temperature: -30°C ~ 105°C (TC), Voltage - Supply: 1.1V, Technology: SDRAM - Mobile LPDDR4, Clock Frequency: 1.6 GHz, Memory Format: DRAM, Supplier Device Package: 200-WFBGA (10x14.5), Memory Organization: 256M x 32, DigiKey Programmable: Not Verified.