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NX3DV221GM,132

NX3DV221GM,132 NXP USA Inc.

NX3DV221.pdf Виробник: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Features: Bi-Directional
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
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Технічний опис NX3DV221GM,132 NXP USA Inc.

Description: IC USB 2.0 SWITCH HS 10XQFN, Features: Bi-Directional, Packaging: Tape & Reel (TR), Package / Case: 10-XFQFN, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Applications: USB, On-State Resistance (Max): 7Ohm, -3db Bandwidth: 1GHz, Supplier Device Package: 10-XQFN (1.55x2), Voltage - Supply, Single (V+): 2.3V ~ 3.6V, Multiplexer/Demultiplexer Circuit: 2:1, Number of Channels: 1.