Технічний опис NX3DV221GM,132 NXP Semiconductors
Description: IC USB 2.0 SWITCH HS 10XQFN, Packaging: Tape & Reel (TR), Features: Bi-Directional, Package / Case: 10-XFQFN, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Applications: USB, On-State Resistance (Max): 7Ohm, -3db Bandwidth: 1GHz, Supplier Device Package: 10-XQFN (1.55x2), Voltage - Supply, Single (V+): 2.3V ~ 3.6V, Multiplexer/Demultiplexer Circuit: 2:1, Number of Channels: 1.
Інші пропозиції NX3DV221GM,132
| Фото | Назва | Виробник | Інформація |
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Ціна |
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NX3DV221GM,132 | Виробник : NXP USA Inc. |
 Description: IC USB 2.0 SWITCH HS 10XQFNPackaging: Tape & Reel (TR) Features: Bi-Directional Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: USB On-State Resistance (Max): 7Ohm -3db Bandwidth: 1GHz Supplier Device Package: 10-XQFN (1.55x2) Voltage - Supply, Single (V+): 2.3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 1 |
товару немає в наявності |