OS-S031 MENDA/EasyBraid
Виробник: MENDA/EasyBraid
Description: SOLDER NO-CLEAN .031" X 20'
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool
Process: Leaded
Flux Type: No-Clean
Description: SOLDER NO-CLEAN .031" X 20'
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool
Process: Leaded
Flux Type: No-Clean
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Технічний опис OS-S031 MENDA/EasyBraid
Description: SOLDER NO-CLEAN .031" X 20', Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, Process: Leaded, Flux Type: No-Clean.